Dialog Semiconductor announced both the new DA14531, the world’s smallest and most power-efficient Bluetooth 5.1 SoC, and the DA14531 module, to simplify Bluetooth product development and enable wider adoption.
The chip, also known as SmartBond TINY™, is currently in production. It will further extend Dialog’s position as a leader in the Bluetooth device market with the broadest SoC portfolio, as the company converges on yearly shipments of up to 100 million units.
SmartBond TINY is specifically designed to lower the costs of adding BLE functionality to an application to as little as $0.50 in high volumes, fueling the next wave of the IoT, estimated to span over 1 billion devices.
As the list of devices requiring wireless connectivity continues to grow, the cost of enabling a complete IoT system is under pressure. SmartBond TINY addresses the growing breadth and costs of IoT devices by enabling a complete system cost reduction through a smaller footprint and size, while maintaining performance quality at a level unmatched by its competitors. The DA14531 makes it possible to extend wireless connectivity to applications where it would have previously been prohibitive in terms of size, power or cost, especially those within the growing connected medical field. SmartBond TINY will help facilitate connectivity for inhalers, medicine dispensers, weight scales, thermometers, glucose meters and more.