Winbond’s LPDDR4/4X 100BGA achieves JEDEC standard for improved energy conservation and carbon reduction in a smaller package size
Winbond Electronics Corporation announced that its new package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction. The LPDDR4/4X is now available in a space-saving 100BGA package measuring only 7.5X10mm2. The device is ideal for IoT applications requiring higher throughput in a small package to allow designers to reduce the PCB size for more compact IoT designs
Winbond’s LPDDR4/4X memory is available in density of 1Gb and 2Gb, supporting speeds of up to 4267Mbps. It is available in both Single-Die-Package (SDP) with a 2Gb density and Dual-Die-Package (DDP) with a 4Gb density. The higher speed of LPDDR4 1CH x16 4267Mbps offers improved performance over previous DDR4 x16 3200Mbps devices, which is especially useful for consumer applications. Winbond guarantees the LPDDR4/4X product line will be manufactured for at least the next ten years, which is good news for automotive and industrial applications where long design cycles are common practice.